SEMICONDUCTOR PACKAGE, METHOD OF PRODUCING THE SAME, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS

摘要

A camera module (1) has a lens member (20) attached to a semiconductor package (10). The semiconductor package (10) has an image sensor (11) mounted on a wiring board (13) and a wire (15) for electrically connecting the wiring board (13) and the image sensor (11). The image sensor (11) is sealed together with the wire (15) by mold resin (14). A step (18) is formed at the perimeter edge of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting to each other the step (18) and a projection (23) of the lens holder (22). Accordingly, the semiconductor package and the mounting component joint to the package are highly precisely aligned with each other, and the semiconductor package that can be reduced in side is realized.