发明名称 Micro-mechanically strained semiconductor film
摘要 A semiconductor structure embodiment comprises a semiconductor membrane with local strained areas. The membrane with local strained areas is formed by a process including performing a local oxidation of silicon (LOCOS) process in a substrate and removing resulting oxide to form a recess in the substrate, and bonding a semiconductor membrane to the substrate to induce a strain where the membrane conforms to the recess in the substrate.
申请公布号 US7405444(B2) 申请公布日期 2008.07.29
申请号 US20070707214 申请日期 2007.02.13
申请人 发明人
分类号 H01L27/01 主分类号 H01L27/01
代理机构 代理人
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