发明名称 Circuit board device and method of interconnecting wiring boards
摘要 A circuit board device comprises a first wiring board ( 79 ) having plural first electrode terminals ( 73, 75, 77 ) for connection row-arranged on a surface layer, a second wiring board ( 87 ) having plural second electrode terminals ( 81, 83, 85 ) for connection row-arranged on a surface layer, and an anisotropic conductive member ( 89 ) disposed therebetween to the electrode terminals ( 73, 75, 77, 81, 83, 85 ). A local portion of each of the wiring boards ( 79, 87 ) has a step difference to divide and dispose the electrode terminals ( 73, 75, 77, 81, 83, 85 ). A local portion of the anisotropic conductive member ( 89 ) corresponding to the step difference has a step shape that is capable of contacting with the step difference. A laminate comprising respective wiring boards ( 79, 87 ) and the anisotropic conductive member disposed therebetween is pressed and held in a lamination direction.
申请公布号 US7405948(B2) 申请公布日期 2008.07.29
申请号 US20040543253 申请日期 2004.01.22
申请人 NEC CORPORATION 发明人 SATO JUNYA;HASHIMOTO YOSHIYUKI;KOIZUMI MASAKAZU
分类号 H05K1/11;H01R13/24;H05K1/00;H05K3/32;H05K3/36 主分类号 H05K1/11
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