发明名称 |
Decoupled signal-power substrate architecture |
摘要 |
A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such that the integrated circuit is electrically coupled to the substrate core through the routing layer.
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申请公布号 |
US7405364(B2) |
申请公布日期 |
2008.07.29 |
申请号 |
US20020335026 |
申请日期 |
2002.12.30 |
申请人 |
INTEL CORPORATION |
发明人 |
NAIR RAJENDRAN;TANG JOHN |
分类号 |
H05K3/30;H01L23/498;H01L23/50;H05K1/14;H05K1/16;H05K3/46 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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