| 摘要 |
3D Electronic Packaging Structure with Enhanced Grounding Performance and Embedded Antenna The present invention proposes a 3D electronic packaging structure with enhanced grounding performance and embedded antenna, and the packaging unit can achieve multi-chip stacking through the signal contacts on the top and bottom surfaces of the unit. A single or multiple grounding layers are on the back of the substrate in the packaging unit to facilitate the grounding for the semiconductor element; further, the packaging unit is applicable to a wafer level packaging process, so the manufacturing cost of each individual packaging unit is reduced. The above grounding layers are also the signal transmission paths of the ii electronic elements in the packaging structure of the invention, and a single or multiple via holes around the electronic element layers allow electrical signal connection between the top and bottom surfaces of the packaging structure, and thus enable more functionality in the packaging unit. Moreover, the grounding layers may have circular signal channels to construct a 3D stacked packaging structure with embedded antenna. |
