| 摘要 |
A transferring system for processing and transferring a semiconductor is provided to reduce footprint by using a foup(Front Open Unified Pod) transferring unit capable of moving back and forth and drawing a wafer into and out of load lock chambers. A transferring system for processing a semiconductor material comprises a body frame, a foup(Front Open Unified Pod) loading unit, a foup transferring unit(60), a door opening/closing unit(95), and a load lock chamber(30). The body frame has an opening unit at one side where the foup is injected in and out. The foup loading unit, adjacent to the opening of the body frame, loads the foup and supplies the foup when is needed. The foup transferring unit transfers the foup horizontally from the foup loading unit to a predetermined location, and being ascended to place the semiconductor material at a drawing locating. The door opening/closing unit opens a door of the foup. The load lock chamber, located between the foup transferring unit and a process chamber, wherein a dual transferring arm is installed to transfer the semiconductor material from the foup to the process chamber.
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