ACOUSTIC SIGNAL/ELECTRIC SIGNAL CONVERTING PACKAGE

摘要

An acoustic signal/electric signal conversion package is provided to reduce a manufacturing cost by contacting an outer conducting layer of a printed circuit board with a bottom conducting layer and forming a vertically/horizontally electrical connection flexibly. An acoustic signal/electric signal conversion package includes a printed circuit board(13), a side plate(12), and an upper plate(11). The printed circuit board has an acoustic signal/electric signal conversion element(14), and a circuit structure(15). An outer conducting layer of the printed circuit board is exposed. A bottom conducting layer of the side plate is exposed. The side plate is put on the printed circuit board, and covers a circumference of the acoustic signal/electric signal conversion element and the circuit structure. The upper plate is put on an upper part of the side plate. The upper plate covers the acoustic signal/electric signal conversion element and the circuit structure from an external part. A non-conducting adhesive is arranged on a side part of the outer conducting layer of the printed circuit board. The bottom conducting layer of the side plate is contacted with both sides of the non-conducting adhesive and the outer conducting layer of the printed circuit, and connects the side plate with the printed circuit board physically and electrically.