A cooling device for a refractory mold is provided to form a plurality of gas circulation grooves at a contact part of upper and lower molds and to flow cooling circulation gas through the grooves so as to cool the metal sheet quickly and to prevent the refractory mold from being deformed. A cooling device for a refractory mold comprises a plurality of gas circulation grooves(3) in predetermined intervals to front and rear directions at a contact part of upper and lower molds(1,2) to cool a mold sheet. Nozzles(5) are connected with gas supplies to cross and circulate the gas flowed through the nozzles.
申请公布号
KR20080068958(A)
申请公布日期
2008.07.25
申请号
KR20070006434
申请日期
2007.01.22
申请人
HYUNDAI HEAVY INDUSTRIES CO., LTD.
发明人
KWON, BONG JAE;LEE, YUN SIG;JUNG, MOON YOUNG;BEAK, TAE HYUN;KWON, IL KEUN;KIM, JONG HWA