| 摘要 |
<p>A dynamic wafer stress managing system is provided to obtain accurate information of a blanket wafer and a wafer that has a pattern without a damage of the wafer. A dynamic wafer stress managing system comprises a sample holder, a light source(120), and a detection system(115). The sample holder is configured to analyze features of a sample. The light source generates a beam pattern to be directed toward a first region of the sample. The detection system receives a reflected beam from the sample. The reflected beam is used to determine one or more surface features of the first region of the sample.</p> |
