摘要 |
PROBLEM TO BE SOLVED: To facilitate design that makes it possible to reduce unnecessary electromagnetic radiation resulting from a common-mode current about a system including the ground of a printed board and a metallic casing, when the ground of the printed board is connected and secured to the metallic casing. SOLUTION: Using the distance between the printed board and the ground layer of the printed board and the number of connected and secured portions when the ground layer of the printed board is connected to the metallic casing, an optimum ground-metallic casing connection condition calculating part 105 calculates the resistance value (impedance value) of a component disposed either in a connecting/locking component or in part of wiring leading to it, as an optimum connection condition for reducing unnecessary electromagnetic radiation resulting from a common-mode current. COPYRIGHT: (C)2008,JPO&INPIT
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