发明名称 ELECTRONIC DEVICE DESIGN SUPPORT APPARATUS AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To facilitate design that makes it possible to reduce unnecessary electromagnetic radiation resulting from a common-mode current about a system including the ground of a printed board and a metallic casing, when the ground of the printed board is connected and secured to the metallic casing. SOLUTION: Using the distance between the printed board and the ground layer of the printed board and the number of connected and secured portions when the ground layer of the printed board is connected to the metallic casing, an optimum ground-metallic casing connection condition calculating part 105 calculates the resistance value (impedance value) of a component disposed either in a connecting/locking component or in part of wiring leading to it, as an optimum connection condition for reducing unnecessary electromagnetic radiation resulting from a common-mode current. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008171106(A) 申请公布日期 2008.07.24
申请号 JP20070002187 申请日期 2007.01.10
申请人 NEC CORP 发明人 HOSHINO SHIGEKI
分类号 G06F17/50 主分类号 G06F17/50
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