发明名称 |
HEAT SINK WITH PREATTACHED THERMAL INTERFACE MATERIAL AND METHOD OF MAKING SAME |
摘要 |
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.
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申请公布号 |
US2008174007(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20080044581 |
申请日期 |
2008.03.07 |
申请人 |
INTEL CORPORATION |
发明人 |
HOULE SABINA J.;DEPPISCH CARL |
分类号 |
H01L23/34;H01L21/44;H01L21/48;H01L23/42 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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