| 摘要 |
A clamshell enclosure is disclosed for providing thermal and kinetic management for an enclosed electronic circuit. The clamshell enclosure comprises a sealed clamshell casing containing the circuit, and a cover that in combination with a wall of the clamshell casing forms a duct. A heat exchanger conducts heat from the electronic circuit inside the clamshell casing to a thermal interface element located within the duct, and a thermally conductive gas moving through the duct comes into contact with the interface element, dispelling the heat and thereby cooling the enclosed electronic circuit. A cellular topology of the clamshell casing and of the cover provides stiffness to the enclosure and reduces the effects of shock and vibration on the enclosed electronic circuit.
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