| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an abrasive pad used for the chemical mechanical polishing which sufficiently suppresses occurrence of scratches on a surface to be polished. <P>SOLUTION: A circular recess is formed on a non-abrasive surface side of an abrasive pad to suppress generation of excessive stresses in a center of the abrasive pad. The recess is located in a center of a surface to be polished, and its depth is 0.01-2 mm. The abrasive pad is formed of a material consisting of a water insoluble matrix and water-soluble particles dispersed in the matrix. The depth of grooves is made larger than the size of the water-soluble particles. <P>COPYRIGHT: (C)2008,JPO&INPIT |
