发明名称 CERAMIC PACKAGE FOR LED
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting diode (LED) mounted on a ceramic board. <P>SOLUTION: The ceramic LED package has a pair of remote reflection walls 2411, 2412 between which there are arranged an LED 22. Metal regions 221, 222 are arranged on a first side of the ceramic board 21, and two top-surface electrodes of the LED are respectively connected to the metal regions with bonding wires 23. With two opposing reflection walls and two opposing openings surrounding the LED, the light emitted from the ceramic package can be spread around. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008172194(A) 申请公布日期 2008.07.24
申请号 JP20070249590 申请日期 2007.09.26
申请人 LEDTECH ELECTRONICS CORP 发明人 LIU HSIN-CHUN;SU CHIH-LIANG;WANG YAO-I;WANG FANG-PO
分类号 H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/56
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