| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reinforcing effects of a solder connection portion by surely supplying an underfill to a solder connection portion of a package center portion, the underfill applied from the surrounding of an LGA package soldered on a printed board. <P>SOLUTION: Grooves 3 for reserving flux in solder paste which is molten and flows out to the vicinity of the connection portion a when an LGA package is electrically mechanically connected using the solder are formed around each of PADs 2 for solder connection arranged in accordance with connection terminals arranged like area on the lower surface of the LGA package on the surface of a printed board 1 where the LGA package is mounted. This configuration can prevent the flux from wetting and spreading between the lower surface of the LGA package and the surface of the printed board 1, so that an underfil applied from the vicinity of the mounted LGA package after soldering can be surely supplied even to the solder connection portion of the package center portion. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
