| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus in which a higher processing temperature can be provided. <P>SOLUTION: The semiconductor manufacturing apparatus includes a susceptor body 5 serving as a rotary susceptor that holds workpieces of substrates 26, and a rotating shaft 13 that transmits torque to the susceptor body 5. A rotating shaft connection is disposed on the front end of the rotating shaft 13 that faces the susceptor 5, and connecting members 15 are disposed at the center of main surface of the susceptor body 5 that faces the rotating shaft 13. The rotating shaft 13 is disposed above the center of main surface of the susceptor body 5 so that the rotation of the rotating shaft 13 causes the side face of the rotating shaft connection to press the side faces of the connecting members 15 to rotate the susceptor body 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
