| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive composition capable of minimizing a formulation amount of a conductive component by localizing the conductive component in the formed coating film enabling formation of a uniform coating film. SOLUTION: The conductive composition contains a conductive material (A), i.e., a pair of ions of aπconjugated polymer (A-2) doped by a polyanion (A-1) and a basic organic compound (A-3) and dissolvable or dispersible in an organic solvent, a non-conductive binder (B), a hydrophilic compound (C), and an organic solvent (D) dissolving or dispersing the compound (A-3) and the binder (B). In the conductive composition, when respective solubility parameters (SP value) of the compound (A-3), the binder (B) and the compound (C) are made toδ(A-3),δ(B),δ(C) (J/cm<SP>3</SP>)<SP>1/2</SP>respectively, the relationδ(A-3)<δ(B)<δ(C) holds. COPYRIGHT: (C)2008,JPO&INPIT
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