CHIP HAVING SIDE PAD, METHOD OF FABRICATING THE SAME AND PACKAGE USING THE SAME

摘要

A semiconductor device includes a first chip having a top surface, a bottom surface and a side surface connected to the top and bottom surfaces. The first chip includes a chip substrate; a lower conductive pattern over the chip substrate; an interlayer dielectric layer over the lower conductive pattern; and an upper conductive pattern over the interlayer dielectric layer. At least a portion of the lower conductive pattern and at least a portion of the upper conductive pattern are exposed on the side surface of the first chip to collectively form a side pad.