发明名称 AL-BASE ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
摘要 <p>This invention provides an Al-base alloy wiring material which, in a display device comprising a thin-film transistor, can realize direct junction also to a semiconductor layer such as an n+-Si layer. The Al-base alloy wiring material comprises nickel and boron incorporated in aluminum and is characterized by further comprising nitrogen (N). The nitrogen content is preferably not less than 2 8 1017 atoms/cm3 and less than9 8 1021 atoms/cm3. Preferably, the Al-base alloy wiring material satisfies each of formulae 0.5 = 1.00, and y + 1.15x <= 11.50, provided that x + y + z = 100, wherein x represents the composition ratio of nickel, at.%; y represents the composition ratio of boron, at.%; and z represents the composition ratio of aluminum, at.%, and the balance of the Al-base alloy wiring material comprises nitrogen.</p>
申请公布号 KR20080068906(A) 申请公布日期 2008.07.24
申请号 KR20087013512 申请日期 2007.10.22
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 URABE HIRONARI;MATSUURA YOSHINORI;KUBOTA TAKASHI
分类号 C22C21/00;H01L21/3205;H01L23/52;H01L29/786 主分类号 C22C21/00
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