发明名称 PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE PRINTED WIRING BOARD, LEAD FRAME PACKAGE, AND OPTICAL MODULE
摘要 A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
申请公布号 US2008172871(A1) 申请公布日期 2008.07.24
申请号 US20080041457 申请日期 2008.03.03
申请人 THE FURUKAWA ELECTRIC CO, LTD. 发明人 SHIRAI TAKEHIRO;IWASE MASAYUKI
分类号 H05K3/06;B23K26/00;G02B6/38;G02B6/42;H01B13/00;H01L23/24;H01L23/498;H01R12/00;H05K1/05;H05K3/44 主分类号 H05K3/06
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