发明名称 |
PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE PRINTED WIRING BOARD, LEAD FRAME PACKAGE, AND OPTICAL MODULE |
摘要 |
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
|
申请公布号 |
US2008172871(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20080041457 |
申请日期 |
2008.03.03 |
申请人 |
THE FURUKAWA ELECTRIC CO, LTD. |
发明人 |
SHIRAI TAKEHIRO;IWASE MASAYUKI |
分类号 |
H05K3/06;B23K26/00;G02B6/38;G02B6/42;H01B13/00;H01L23/24;H01L23/498;H01R12/00;H05K1/05;H05K3/44 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|