FOLDED PACKAGE CAMERA MODULE AND METHOD OF MANUFACTURE

摘要

An image-capture-device/processor package includes a flexible circuit sub strate, an image capture device mounted on the flexible circuit substrate, a second device (e.g., processor) mounted on the flexible substrate, and a st iffener for at least partially supporting the second device. The ICD and the second device may be flip-chip mounted to the same surface of the flexible circuit substrate. The flexible circuit substrate may be folded so that the ICD is positioned back-to-back with the second device. The flexible circuit substrate may further include Land Grid Array (LGA) pads formed thereon to f acilitate electrical connection with a host device.