| 摘要 |
PROBLEM TO BE SOLVED: To form a pattern on a body under the state suppressing the dispersion of the line width (such as the dispersion of a hole diameter in the case of a contact-hole pattern) of the pattern. SOLUTION: A first exposure moved in the Y-axis direction while arranging a wafer W at a first place displaced from the best focus place of a projection optical system PL to the -Z side and a second exposure moved in the same direction as the first exposure while arranging the wafer W at a second place from the best focus place to the +Z side are carried out by a main controller 50 by controlling a wafer stage WST through the desired value of a focus sensor AFS and a wafer-stage driving system 56. Accordingly, a target place related to the optic-axis direction of the projection optical system, which must position a wafer surface, is set on one side and the other side of the best focus place respectively by a first scanning exposure and a second scanning exposure, and exposures equalizing the scanning direction are conducted. COPYRIGHT: (C)2008,JPO&INPIT
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