FLIP CHIP MOUNTING BODY, MOUNTING APPARATUS THEREOF AND BUMP FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a flip chip mounting body which is applicable to the flip chip mounting of a next-generation LSI and has high productivity and reliability, a mounting apparatus for the flip chip mounting body, and a bump forming apparatus.

SOLUTION: After supplying resin 14 containing solder powder 16 and a bubble generating agent to a space between a circuit board 21 having a plurality of connection terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate bubbles from the bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated bubbles according to the growth of the bubbles and self-assembled between the connection terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 18 are formed between the terminals to complete a flip chip mounting body.

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