| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer having an image-capturing element formed thereon, which semiconductor wafer allows an electric test to be conducted efficiently on the wafer without deteriorating the quality of the wafer. SOLUTION: An image-capturing element 5 and a main surface side electrode 3 are formed on the main surface side of a semiconductor substrate 1, to which a reinforcing plate 2 capable of transmitting light in a frequency range that makes light receivable to the image-capturing element 5 is pasted via an adhesive resin 4. The back surface side of the semiconductor substrate 1 is polished, and then a through-hole 6 is so formed on the back surface side that the surface of the main surface side electrode 3 exposes to the through-hole 6, in which a conductive material is formed to form a back surface side electrode 8 on the back surface, the electrode 8 being connected electrically to the main surface side electrode 3 via the conductive material. The semiconductor wafer is constructed in this manner, and test subject light is emitted on the semiconductor wafer from the main surface side while a measuring prove is brought into contact with the semiconductor wafer from the back surface side. COPYRIGHT: (C)2008,JPO&INPIT
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