发明名称 Heating apparatus, heating method, and computer readable storage medium
摘要 A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
申请公布号 US2008175999(A1) 申请公布日期 2008.07.24
申请号 US20080007975 申请日期 2008.01.17
申请人 TOKYO ELECTRON LIMITED 发明人 KAWAJI TATSUYA;SAKAI YUICHI;KANEDA MASATOSHI
分类号 B05C11/06;B05D3/00 主分类号 B05C11/06
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