| 摘要 |
One embodiment relates to an electrical component cooling system [100] that facilitates convectional air flow. The system includes a set of electrical component boards [160], an inlet [122, 124], an outlet [140], and a housing [170]. The electrical component boards[160] each include a plurality of electrical components and are oriented vertically. The inlet [122, 124] is disposed on the housing below the electrical component boards [160], and the outlet [140] is disposed on the housing [170] above the electrical component boards [160]. The housing [170] substantially encases the electrical component boards [160] and further includes a plenum [120]. The inlet [122, 124] enables ambient air to flow into the plenum [120] disposed within an internal region of the housing [170]. The plenum [120] horizontally directs the air to locations vertically aligned with the regions between the electrical component boards [160] to facilitate convectional air flow in the vertical direction. Heat transfer occurs between the electrical component boards [160] and the air as it flows across the surfaces of the electrical component boards [160].
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