| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting diode array improving a yield fail in a large-area light-emitting diode of a well-known technique. <P>SOLUTION: A light-emitting diode chip is prepared first. The light-emitting diode chip is a substrate including a light-emitting diode epitaxy layer. The light-emitting diode chip is cut for forming a plurality of light-emitting diode sticks, and then one spacing layer adheres between two light-emitting diode sticks to form the light-emitting diode array. <P>COPYRIGHT: (C)2008,JPO&INPIT |
