发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition which ensures high resolution even if the concentration of an acid generator in the resist composition is made higher, and a resist pattern forming method using the positive resist composition. <P>SOLUTION: The positive resist composition contains a base material component (A) of which the alkali solubility increases under the action of an acid and an acid generator component (B) which generates an acid upon irradiation with radiation, wherein the base material component (A) contains a compound (A1) obtained by substituting part or all of the hydrogen atoms of hydroxyl groups in a phenol compound represented by general formula (I) or a substituted phenol compound by an acid-dissociable dissolution inhibiting group, wherein the substituted phenol compound is obtained by substituting part or all of the hydrogen atoms of hydroxyl groups in the phenol compound by a 1-10C alkyl group, and wherein a content of the acid generator component (B) to the base material component (A) exceeds 10 mass%. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008170784(A) 申请公布日期 2008.07.24
申请号 JP20070004583 申请日期 2007.01.12
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIONO HIROHISA;SUZUKI TAKAKO
分类号 G03F7/004;C07C59/13;C07C69/712;G03F7/039;H01L21/027 主分类号 G03F7/004
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