发明名称 |
METHOD FOR FORMING POLYSILICON, THIN FILM TRANSISTOR HAVING THE POLYSILICON, AND METHOD FOR FORMING THE THIN FILM TRANSISTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming polysilicon, a thin film transistor having the polysilicon, and a method for forming the thin film transistor. SOLUTION: The method for forming polysilicon includes: a step for forming an insulation layer 120 on a substrate 110; a step for forming a first electrode 131 and a second electrode 132 on the insulation layer 120; a step for forming at least one heater layer 140 on the insulation layer 120 so as to connect the first electrode 131 and the second electrode 132; a step for forming an amorphous material layer containing silicon at least on the one heater layer 140; a step for forming a through hole 125 at the bottom of the heater layer 140 by etching the insulation layer 120; and a step for crystallizing the amorphous material layer on a polysilicon layer 160 by applying a voltage between the first electrode 131 and the second electrode 132 and heating the heater layer 140. COPYRIGHT: (C)2008,JPO&INPIT
|
申请公布号 |
JP2008172245(A) |
申请公布日期 |
2008.07.24 |
申请号 |
JP20080003574 |
申请日期 |
2008.01.10 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHOI JUN-HEE;ZOULKARNEEV ANDREI |
分类号 |
H01L21/20;H01L21/336;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|