| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal component unit having high heat dissipation effect, in which a heating part and a printed circuit board with a signal system electronic part mounted thereon are mounted. <P>SOLUTION: In a conductive heat transfer board, a metallic plate 12, a sheet-shaped heat transmission layer 14, a lead wire 11 made up of a lead frame, more than a part of which is embedded therein, and the like, are provided. In a module, a printed circuit board 15 is connected with the lead wire 11. Since a part of the lead wire 11 has a chimney structure having chimney formation 13, air with specific gravity, which becomes smaller because of heat generated from heating elements, such as the electronic part, is moved up positively. At the same time, cold air is drawn inside through suction force generated there, and the electronic component can be cooled, thereby raising cooling property of the circuit module. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
