| 摘要 |
PROBLEM TO BE SOLVED: To design a heat sink optimally based on the capacity, or the like of each electronic component when arranging a plurality of electronic components on the surface of the heat sink while separating the electronic components. SOLUTION: The heat transfer area of a fin is increased, or the flow rate or flow velocity of coolant circulating immediately below the fin is increased for improving heat transfer properties in a heating element having a larger calorific value or that positioned at a downstream side. COPYRIGHT: (C)2008,JPO&INPIT
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