| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression adhesive for connecting a flip chip, having a high connection reliability such as moisture resistance and heat resistance, and inhibited with the occurrence of void development defect or connection defect caused by resin curing. SOLUTION: This adhesive used for the flip chip connection by joining an electronic part having a metal bump formed with a substrate plate having an electrode pad for conducting the metal bump of the electronic part with the electrode pad of the substrate is characterized by containing (A) an epoxy resin and (B) a fluorinated diamine compound expressed by general formula (1) [wherein, X<SB>1</SB>to X<SB>6</SB>are each independently H or a fluorine element, and at least one is a fluorine element; and (n) is 0 or an integer of 1]. COPYRIGHT: (C)2008,JPO&INPIT |
