HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING HEAT DISSIPATING BASE

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipating device and a method of manufacturing a heat dissipating base that can obviate a defect involved in forging and a tin-soldering method and, simplify manufacturing and assembling processes to reduce manufacturing cost, and also is capable of quickly conducting heat to have efficient heat dissipation. SOLUTION: The heat dissipating device 3 includes a heat dissipating base 31 having a heat dissipating plate 311 with a through hole 3111 and a heat conducting plate 312 arranged in the through hole by clamp fitting, and a heat dissipating unit 32 installed on the heat dissipating base and bonded to the heat dissipating base. COPYRIGHT: (C)2008,JPO&INPIT