发明名称 COOLING STRUCTURE OF ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling structure of electronic equipment enhanced in cooling efficiency, which can perform foreside maintenance of an HDD unit and a secondary battery in electronic equipment such as a computer, and needs no cooling fan. <P>SOLUTION: The cooling structure comprises a casing; a CPU substrate 6 horizontally provided on a top part of the casing; a first heat sink 3 fixed to the outside of the rear surface of the casing to release heat from a heating element 15; a heat lane plate 6 for heat-transporting the heat of the heating element to the first heat sink; a power supply substrate 7 provided on a bottom part of the casing; a partition plate 17 separating a space for the CPU substrate 6 from a space for the power source substrate 7; an HDD unit 12 provided detachably from the front surface of the casing; a second heat sink 4 releasing heat from the HDD unit; and an HDD tray for heat-transporting the heat of the HDD unit. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008171199(A) 申请公布日期 2008.07.24
申请号 JP20070003728 申请日期 2007.01.11
申请人 TOSHIBA CORP 发明人 SUWABE SATORU
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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