| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin film peeling instrument which finds an occasion to peel a thin film from a base material by a simple constitution and peels the thin film, as it is, without rupturing the same. <P>SOLUTION: The thin film peeling instrument includes at least a peeling blade 11, the holding member 12 provided so as to be protruded forward in the advance direction of the peeling blade 11 and holding the leading end of the peeled film and a spacer 13 interposed between the peeling blade 11 and the holding member 12. The gap S1 formed between the peeling blade 11 and the holding member 12 formed by the spacer 13 is formed so as to become larger than the thickness of the thin film to be peeled and the leading end part 11a of the spacer 13 is shifted rearward in the advance direction of the peeling blade 11, to provide a space part 17 between the leading end part of the peeling blade 11 and the holding member 12. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
