| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for supporting a semiconductor wafer that is applicable for semiconductor wafers having various surface shapes. <P>SOLUTION: The device for supporting a semiconductor wafer is provided with a placement table that has a placement face on which a semiconductor is placed, a plurality of pin members that are arranged on the placement face and can move forward or backward to the placement face, and actuators that are provided for each of the pin members and adjust the advancing/independent of forward/backward position of a pin member independent of the other pins. The supporting device independently adjusts the respective forward/backward position of the pin members, so that it can support semiconductor wafers having various surface shapes by plural pin members. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
