| 摘要 |
PROBLEM TO BE SOLVED: To provide a silver conductive film having good adhesion property on a substrate in spite of baking at comparatively low temperature of 300°C or less without adding a silane coupling agent or a thermosetting resin, and to provide a method for manufacturing the same. SOLUTION: A first silver particle dispersion solution is prepared by forming silver particles by a reduction treatment of a silver compound in alcohol or polyol and under existence of a fatty acid compound and an amine compound, and by dispersing the silver particles in a liquid organic solvent. A second silver particle dispersion solution is prepared by forming silver particles by a reduction treatment of a silver compound in alcohol or polyol and under existence of an amine compound, and by dispersing the silver particles in a liquid organic solvent. After coating the first silver particle dispersion solution on a substrate, a first silver conductive layer is formed on the substrate by baking, and after coating the second silver particle dispersion solution on the first silver conductive layer, a second silver conductive layer is formed on the first silver conductive layer, by baking. COPYRIGHT: (C)2008,JPO&INPIT
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