| 摘要 |
The enclosed electronic ballast housing [200] provides improved convection heat transfer for lowering the ambient housin temperature for keeping the junction temperature of power semiconductors [210] inside the enclosed electronic ballast hous?ng[200] within certain specified temperature ranges for long-term reliable operation The enclosed electronic ballast housing [200] includes at least one folded fin [510] on at least one of the enclosed electronic ballast housing surfaces [508], the folded fin [510] may be manufactured from the same piece of material as the ballast housing [200] or improved heat transfer The folded fins [510] are substantially parallel to their respective adjacent surfaces [508] Additionally, the enclosed electronic ballast housing includes separating portions of heat dissipating sections of ballast circuitry [1704] outside of the BALLAST housing [200] |
