| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of efficiently discharging heat generated in a semiconductor element. SOLUTION: A part of a solid-state imaging element 3 is stuck onto the mounting surface 5a of a package 5 by using a thermosetting die bond resin 9. Silicon is filled between the solid-state imaging element 3 and the package 5 as a heat transfer member 7. The silicon has a substantially fixed shape and flexibility when heated with the heat generated in the solid-state imaging element 5, and is excellent in thermal conductivity. COPYRIGHT: (C)2008,JPO&INPIT |
