发明名称 |
HEAT DISSIPATION DEVICE WITH HEAT PIPES |
摘要 |
A heat dissipation device includes a base for contacting an electronic device. Two first heat pipes are arranged on and thermally engaged with the base for absorbing heat from the electronic device and spread the heat to the base. Each of the two first heat pipes is sinuous and defines two U-shaped portions on the base. Two second heat pipes are thermally engaged with the base for absorbing heat from the electronic device and spreading the heat to the base. Each of the two second heat pipes has a first section located at a corresponding one of the two U-shaped portions on the base. A fin set is located on the base for dissipating heat in the base to ambient air.
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申请公布号 |
US2008173431(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20070626159 |
申请日期 |
2007.01.23 |
申请人 |
FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
YANG PING-AN;FU MENG;CHEN CHUN-CHI |
分类号 |
F28D15/00 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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