| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser cutting method by which the shape of a chip-size substrate is not distorted even when forming recessed parts being starting points on a strip-shaped slave substrate to be worked after primary cutting. <P>SOLUTION: By preparing a master substrate 1 to be worked composed of a brittle material such as ceramics and manufacturing the strip-shaped slave substrate 1a to be worked by performing the primary cutting of the master substrate 1 to be worked along a broken line Y being a cutting predetermining part and forming holes 3 along a cutting line K, the strip-shaped slave substrate 1a to be worked is cut by taking the recessed part 3a as the starting point and the chip-sized substrate 1b is manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
