| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board capable of easily removing an interlayer adhesive layer and an outer layer base corresponding to a lead pattern portion with high precision. SOLUTION: An inner layer circuit pattern portion Acf and a lead pattern portion At are formed, the outer layer base 20 is prepared, the interlayer adhesive layer 25 with an inner layer separation film 27 having mold releasability on to the inner layer base 10 is being prepared, the interlayer adhesive layer 25 is laminated on the outer layer base 20, the inner layer separation film 27 corresponding to the lead pattern portion At is molded and a molding inner layer separation film 28 is formed, the molding inner layer separation film 28 is aligned with the lead pattern portion At and the outer layer base 20 is laminated on the inner layer base 10 via the interlayer adhesive layer 25, a conductor layer 22 of the outer layer base 20 is patterned and an outer layer circuit pattern portion Ace corresponding to an inner layer circuit pattern portion Acf is formed, and the molding inner layer separation film 28 is separated from the inner layer base 10 and the interlayer adhesive layer 25 and the outer layer base 20 laminated on the molding inner layer separation film 28 are removed. COPYRIGHT: (C)2008,JPO&INPIT |
