发明名称 PUNCH DIE
摘要 PROBLEM TO BE SOLVED: To provide a punch die restraining punching flashes while securing the life of the punch die in punching a printed wiring board. SOLUTION: In this punch die 11 used for punching a flexible printed wiring board 50A, corrugated indentations and projections 12 seen from a side are continuously formed on a bottom face of the punch die 11, and the indentations and projections 12 are provided diagonally in parallel seen from a bottom face across the entire bottom face. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008168384(A) 申请公布日期 2008.07.24
申请号 JP20070003545 申请日期 2007.01.11
申请人 NIPPON MEKTRON LTD 发明人 ITO JIRO
分类号 B26F1/14;H05K3/00 主分类号 B26F1/14
代理机构 代理人
主权项
地址