发明名称 MOLD AND MOLD APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the time for one cycle of the mold from heating to cooling and eliminate the need of a special structure of the mold. SOLUTION: Water connection ducts 3 and 6 of a thickness of about 10 mm made of a material free of induction heating are arranged between molds 1 and 4 and induction heating coils 2 and 5, respectively. The arrangement enables induction heating of the molds most efficiently at the distance of about 10 mm between the molds and the induction heating coils and thus allows heating of the molds to a needed temperature in a short time. When cold water is passed through the water connection ducts, the molds can be cooled in a short time. Therefore, the time for one cycle of the molds from their heating to cooling can be reduced. Because requiring neither embedding of induction heating coils in the molds nor piercing of water connection holes in the molds, the apparatus eliminates the need of a special structure for the molds, allowing a cost reduction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008168495(A) 申请公布日期 2008.07.24
申请号 JP20070003146 申请日期 2007.01.11
申请人 TOTOKU ELECTRIC CO LTD 发明人 KANAZAWA SHUICHI
分类号 B29C33/08 主分类号 B29C33/08
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