发明名称 |
METHODS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR WORKPIECES |
摘要 |
Methods and systems for processing semiconductor workpieces are disclosed herein. In one embodiment, a method for processing a semiconductor workpiece includes releasably attaching a plurality of microelectronic dies to a first side of a releasable film, and at least partially detaching one of the dies from the releasable film by pivoting a contact member with a surface of the contact member pressing against a second side of the releasable film.
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申请公布号 |
US2008172869(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20070742419 |
申请日期 |
2007.04.30 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
PUAH KIA HENG;TAY LIANG CHEE |
分类号 |
H05K3/30;B23P19/00;H05K13/04 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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