SEMICONDUCTOR DEVICE PROVIDED WITH LIGHT RECEIVING MEANS, METHOD FOR INSPECTING THE SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE INSPECTING APPARATUS

摘要

Provided is a semiconductor device having a light receiving means. The devices required to be inspected by applying light can be inspected at one time by planarly arranging them. A method for inspecting the semiconductor device and a semiconductor device inspecting apparatus are also provided. The surface of a semiconductor device (110) is provided with a light receiving means (111a), an inspection information processing means (111c) which is electrically connected to the light receiving means (111a) and inspects operation of the light receiving means (111a); and a plurality of inspection electrode pads (113) electrically connected to the inspection information processing means (111c). Pairs of the inspection electrode pads (113) are arranged on the outer peripheral sections of a pair of facing sides on the semiconductor device (110), respectively.