| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating device such as a reflow soldering device and the like of high heat insulating property. SOLUTION: This reflow soldering device solders a printed board 6 loading electronic components by heating it in a heating chamber (preheating chamber 2, reflow chamber 3) of the furnace 1 while conveying it by a conveyor 5. The inside of the furnace 1 is surrounded by a steel plate 7, and a heat insulating layer 8 composed of a heat insulating material, a heat-proof resin sheet 9, a heat insulating layer composed of a heat insulating material, and a resin sheet 11 are successively disposed in adjacent to each other at its outer side to constitute a peripheral wall of the furnace 1. The heat insulating material of the heat insulating layers 8, 10 is composed of, for example, rock wool, glass wool and the like. The heat insulating resin sheet 9 is composed of, for example, a polyimide resin and a fluororesin. The outer resin sheet 11 is composed of, for example, a polyimide resin and a fluororesin though it does not need as much of heat resistance as that of the heat-resisting resin sheet 9 of the inside. COPYRIGHT: (C)2008,JPO&INPIT |
