METHOD FOR PRODUCTION OF CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method which can quickly produce a circuit board of which etch factor is enhanced (the amount of undercut is reduced) to obtain a circuit board with a circuit especially thicker than ordinary cases. SOLUTION: It is related to the method for production of a circuit board 1 by making a circuit on one or both sides of an insulating substrate 2. A metal layer 3 with a thickness of 105μm or more is formed on one or each of the both sides of the insulating substrate 2. This is laser processed after machining processes. A part 3a of the metal layer where the circuit is not formed is removed and a circuit part 3b is remained to form the circuit. COPYRIGHT: (C)2008,JPO&INPIT