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发明名称
Solder Composition
摘要
A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.
申请公布号
US2008175748(A1)
申请公布日期
2008.07.24
申请号
US20080045322
申请日期
2008.03.10
申请人
发明人
PEREIRA JOHN
分类号
C22C13/00;C22C28/00;C22C30/04
主分类号
C22C13/00
代理机构
代理人
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地址
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