发明名称 |
LOW TEMPERATURE CURING OF TOUGHENED EPOXY ADHESIVES |
摘要 |
<p>Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140°C and 160°C for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.</p> |
申请公布号 |
WO2008087467(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
WO2007IB00190 |
申请日期 |
2007.01.17 |
申请人 |
HEXCEL COMPOSITES, LTD.;ASPIN, IAN |
发明人 |
ASPIN, IAN |
分类号 |
C09J5/04;C09J5/06;C09J163/00 |
主分类号 |
C09J5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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